Ahead of its official unveiling at MWC 2019, LG has revealed details on its new flagship smartphone, dubbed G8 ThinQ, and its new 3D-scanning selfie camera.

LG’s announcement didn’t include many specifications or any images of the successor to last year’s LG G7 ThinQ.

The G8 ThinQ will feature time-of-flight (ToF) technology, developed with Infineon’s REAL3 image sensor chip, which enables cameras to measure distance and recognise 3D objects via infrared light.

This would allow the G8 ThinQ to feature facial recognition and phone unlock — similar to Apple iPhones FaceID — as well as blur backgrounds in selfies, and include potential AR applications like overlaying digital graphics onto images.

LG G8 ThinQ ToF LG Unveil G8 ThinQ With 3D Face Unlock

The company’s post doesn’t go into much detail, but it does state that the tech will offer “a new level of front camera capability in a smartphone.”

“Keeping in mind LG’s goal to provide real value to its mobile customers, our newest flagship was designed with ToF technology from inception to give users a unique and secure verification system without sacrificing camera capabilities,” said Chang Ma, senior VP and head of Product Strategy at LG Mobile Communications.

“The LG G8 ThinQ featuring ToF will be an optimal choice for users in search of a premium smartphone that offers unmatched camera capabilities.”

LG isn’t the first company to produce a phone with a ToF sensor, several more are expected to release this year, including the Honor View 20 which has a rear-facing ToF sensor.

The G8 ThinQ will be revealed at Mobile World Congress in Barcelona this February.

LG G7 1 LG Unveil G8 ThinQ With 3D Face Unlock

MSI JB 728x90 LG Unveil G8 ThinQ With 3D Face Unlock
BEL1987 728x90 LG Unveil G8 ThinQ With 3D Face Unlock
Jabra 728x90 A LG Unveil G8 ThinQ With 3D Face Unlock
Jabra 728x90 B LG Unveil G8 ThinQ With 3D Face Unlock